AlphaPro adhesive strength is established through rapid curing by heating, making it suitable for bonding metal interface materials. It has high bonding strength, low shrinkage, high impedance, and temperature resistance. Common application cases include connector sealing protection, chip underfill, transformer structural bonding, Die Attach, and so on.
*Shear Strength/MP data is based on common interface material to be attached. Please request if there is any other demand.
| MODEL | FUNCTION | COMP | Curing conditions | COLOR | Viscosity mPa.s |
Shear Strength Mpa |
Tg | Characteristic |
| EPUF101B | Underfill | 1K | 130℃@10min | BLACK | 580 | 15 | 110 | Good fluidity, Fast curing, and Repairable. |
| EPUF102 | Underfill | 130℃@10min | LIGHT YELLOW | 420 | 15 | 36 | Low Tg and Repairable | |
| EPCR101 | Corners Strengthen | 80℃@5-10min | BLACK | 7500 | 15 | 30 | High thixotropy, high temperature resistance and repairable | |
| EPAA101B | DA Glue | UV3000mj+80℃@60min | BLACK | 71000 | PCB:17 | 27 | Low shrinkage, Fast curing. | |
| EPAA102B | AA Gule | UV3000mj+80℃@60min | BLACK | 71000 | PCB:17 | 27 | Dual curing, Low shrinkage, Low light transmittance | |
| EPLA103B | LHA Gule | 80℃@60min | BLACK | 16000 | PCB:18 | 31 | Low shrinkage, low precipitation, low light transmittance | |
| AEP104 | Structural bonding | 60℃@30min | LIGHT YELLOW | 12500 | AI:20 | / | Low-temperature curing |
| MODEL | FUNCTION | COMP | Curing conditions | COLOR | Viscosity mPa.s |
Shear Strength Mpa |
Shore | Characteristic |
| AEP201 | Sealing protection | 2K 1:1 | Room temperature |
Clear |
16000 | SUS:15 | 45 | High temperature resistance
and Chemical resistance. |
| AEP202B | Sealing protection | 2K 1:1 | Room temperature |
BLACK |
31000 | PVC:5.5 | 15 | Good electrical properties, excellent tensile properties and sealing performance. |
以上为行业常用标准规格，其他规格可根据需求提供；
上述数据在标准、稳定的实验室环境下测试获得，实际参数请按照实际应用场景数据。
*Data and spec above are the commonly used standard in the industry, for other spec can be provided according to your needs (please leave us message). And the data are obtained through testing in standard laboratory environment. For actual parameters, please refer to the data of the actual application scenario.