Consumer Electronics

2024-10-10

These solutions all reflect in-depth considerations of material science, thermal management, electromagnetic compatibility, and environmental protection in the design of electronic devices, aiming to enhance product performance and user experience through material innovation.

Semiconductor

2024-10-10

In the field of semiconductor packaging, underfill adhesive, as a key material, is used in flip-chip, stacked packaging, and 2.5D/3D integrated packaging.

Optical Communication

2024-10-10

Specific non-conductive adhesive formulations have electromagnetic shielding capabilities and can block external electromagnetic interference, providing necessary electromagnetic compatibility (EMC) protection for electronic devices.

New Energy Module

2024-10-10

Functional materials for new energy battery modules are high-performance composite materials specially designed for new energy battery modules, with key structural bonding functions.

OLED modules

2024-10-10

For the glass covers of mobile devices such as smartphones, Alpha has developed anti-break film tape. This tape can enhance the impact resistance of the glass cover without sacrificing visual and touch experience.