Intelligent Robots

2024-10-10

AlphaPro® specifically designed products for key components such as the head FSD chip and frameless torque motors. With high thermal conductivity gel and epoxy structural adhesives that can withstand dynamic loads, it helps you achieve high thermal conductivity and strong fatigue resistance, providing differentiated adaptation to meet the complex working conditions commonly found in embodied intelligence.

Semiconductors

2024-10-10

In the chip packaging process, AlphaPro® offers high Tg and low CTE underfill adhesives, as well as high-temperature, fast-curing Edgebond adhesives. These products combine low-temperature rapid curing, easy reworkability, and excellent aging performance, offering significant technical advantages over traditional packaging adhesives.

Optical Communications

2024-10-10

For laser pump sources and passive WDM devices, AlphaPro® adhesives feature dual curing (photo and thermal), extremely low displacement, and low shrinkage. Coupled with resistance to reflow soldering and efficient coupling capabilities, they provide your products with differentiated advantages in optical performance and stability.

New Energy

2024-10-10

AlphaPro® has specially designed high thermal conductivity structural adhesives and closed-cell foam FIPFG sealants for battery cells and battery modules. These can enhance the heat dissipation efficiency of your products. Additionally, with high elasticity, high elongation, and resistance to electrolyte corrosion, they far exceed conventional adhesives in terms of thermal conductivity and sealing performance.

Optoelectronic Displays

2024-10-10

AlphaPro® offers shielding conductive adhesives that can be used at frequencies above 100 MHz and acetate tape with excellent insulation properties. These products achieve efficient electromagnetic shielding and stable protection, with technical parameters superior to ordinary display adhesives. Reducing costs and increasing efficiency for your products is our pursuit.