AlphaPro wafer dicing tape is not only suitable for ordinary wafers but also meets the cutting needs of small and medium-sized wafers.This tape has strong adhesion ,good elasticity, and is very stable. Its function is to firmly fix the wafer during cutting to prevent the chips on it from falling off.At the same time, due to tape's sensitivity to ultraviolet light, the stickiness becomes smaller under UV light.The wafer can be easily uncovered without leaving any residue.It ensures cutting accuracy and also improves the efficiency of chip collection.