AlphaPro's hot melt adhesives can bond many substrates that are difficult to bond, including metals, plastics, woods, leathers, fabrics, non-woven fabrics and foils. Common application scenarios include but are not limited to chip bonding applications, capping connections of wire-bonded packaged devices, ball grid array packaging, gap filling in smart home appliances, etc.
| NAME | MODEL | THICKNESS μm |
MATERIAL | Hot Melt Temperature | Mechanical parameters N/cm |
| Low-temperature thermosetting adhesive film | ATSAF80 | 80 | PU | 70-80°C | PEAL Force：PC＞40N |
| Thermoplastic film | ATSAF80 | 50 | PU | 110-130°C | |
| Pressure-Sensitive Hot Melt Adhesive | PSHAF03 | / | Rubber | 160-180°C | Sheer Strength > 0.3Mpa Sheer Strength > 0.8Mpa |
| Pressure-Sensitive Hot Melt Adhesive | PSHAF08 | / | Rubber | 160-180°C |
以上为行业常用标准规格，其他规格可根据需求提供；
上述数据在标准、稳定的实验室环境下测试获得，实际参数请按照实际应用场景数据。
*Data and spec above are the commonly used standard in the industry, for other spec can be provided according to your needs (please leave us message). And the data are obtained through testing in standard laboratory environment. For actual parameters, please refer to the data of the actual application scenario.