The third Hong Kong International Innovation and Technology Exhibition (InnoEX), co-organized by the Hong Kong Innovation and Technology Commission and the Hong Kong Trade Development Council, will grandly open at the Hong Kong Convention and Exhibition Centre this Sunday. As a pioneer in semiconductor packaging materials, ‌AlphaPro Technology‌ sincerely invites global partners and industry leaders to join this technological feast, to witness how our star product lineup empowers cutting-edge fields such as semiconductors, AI, embodied intelligence, and eVTOL, and to jointly envision a new landscape of smart manufacturing!

AlphaPro Will bring the following star product matrix to the exhibition: hard core technology drives industrial change

 💬 Semiconductor: creating "invisible armor" for AI chips

Wafer cutting tape 8510: Using ultra-low stress bonding layer and precise thickness control technology, it realizes "zero micro-crack" protection in the ultra-thin wafer cutting of AI chips, improves yield by 15%, and helps efficient mass production of computing power chips.

Chip-level Underfill 1018: the nanoscale flow rate is accurately adapted to 2.5D/3D packaging structure, and the anti-drop performance is increased by 3 times after curing, becoming the "reliability guardian" of HBM high-bandwidth memory packaging.

💬Embodied intelligence and robots: making the "steel body" lighter, stronger and more sensitive

Flexible circuit packaging adhesive 8192:  designed for human robot joints and bionic sensors, maintaining bonding flexibility at extreme temperatures from-40℃ to 230℃, providing tear-resistant and anti-aging protection for dexterous hands and dynamic joints. 

Electromagnetic shielding tape 8941: integrated with conductive silver particles and wave-absorbing layer, the shielding efficiency is more than 80dB, solving the problem of signal interference in precision circuit board of collaborative robot, ensuring zero delay of instruction transmission.

💬 eVTOL and low-altitude economy: the "material black technology" to protect air travel

Lightweightstructural adhesive 7865: the density is only 60% of that of traditional epoxy resin, but the tensile strength is increased to 20MPa. It provides a high strength bonding solution for eVTOL carbon fiber fuselage and battery compartment, helping to break through the range.

Thermal Insulation Silicone Film 3700: can withstand 300℃ instantaneous high temperature and extreme vibration environment, ensure the durability of "high voltage, large current" connection of aircraft electric drive system, and guarantee the safety of air traffic.