**Thermal management and grounding solutions for mobile phone screen backplanes and motherboards**:

- Advanced functional adhesive materials are used to achieve efficient heat conduction and electrical grounding between mobile phone screen backplanes and motherboards. This bonding technology not only optimizes the heat dissipation performance of the device but also ensures the stable grounding of electronic components, thereby improving overall thermal management and electromagnetic compatibility.

**Conductive grounding bonding technology for notebook computer keyboards and functional circuits**:

- Professional conductive bonding materials are utilized to achieve efficient conductive grounding between notebook computer keyboards and functional circuits. This technology ensures accurate transmission of keyboard signals and effective shielding of electromagnetic interference through precise bonding processes, enhancing the user's input experience and the reliability of the device.

**Waterproof and antistatic protection measures for 5G antennas and FPC flexible boards**:

- For 5G antennas and FPC (Flexible Printed Circuit) flexible boards, a protective material with waterproof and antistatic properties has been developed. This material can provide necessary environmental protection while maintaining the flexibility of the circuit board, ensuring the stability of signal transmission and the long-term durability of the device.


**Insulation and thermal conduction fixation scheme for wireless charging modules**:

- A bonding material that integrates insulation, thermal conduction, and fixation functions has been designed for wireless charging modules. This material can effectively conduct heat while ensuring electrical insulation, prevent overheating during the charging process, and ensure the stable installation and long-term reliable operation of the module through its bonding performance.

These solutions all reflect in-depth considerations of material science, thermal management, electromagnetic compatibility, and environmental protection in the design of electronic devices, aiming to enhance product performance and user experience through material innovation.